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USB3.0 A Type,Through Hole Type, Reflow Soldering, Offset

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USB3.0 A Type,Through Hole Type, Reflow Soldering, Offset

Large Image : USB3.0 A Type,Through Hole Type, Reflow Soldering, Offset

Product Details:

Place of Origin:	CHINA
Brand Name:	HULYN
Certification:	UL
Model Number:	HLU-32199-23A

Payment & Shipping Terms:

Price:	0.2-0.3
Packaging Details:	Tape
Delivery Time:	3-5
Payment Terms:	T/T
Supply Ability:	100000 / Month
Minimum Order Quantity:	1000PCS

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Detailed Product Description

SPECIFCATIONS:

Contact current Rating:

1.8 Amperes for pin1&pin4.

0.25 Amperes other contacts

Dielectric Withstanding Voltage:AC 100V(RMS)

Insulation resistance:100Megohms Minimum.

Contact Resistance:

3OmΩ Max for pin1&pin4

5OmΩMax for other contacts

Mechanical Characteristics:

Mating Force:3.5 Newtoms.Maximum

Unmating Force:10 Newtoms.Mlnimum.

Operating Temperature:-55 °C+85 °C

USB3.0 A Type,Through Hole Type, Reflow Soldering, Offset

Contact Details

Shenzhen HuiLy Electronics Co., Ltd.

Contact Person: Mr. xiaoli Zhu

Tel: 86-755-89494830

Fax: 86-755-81720089

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